CICMT 2022

CICMT 2022

Technical Sponsors:

IMAPS Germany



General Chair:
Ulrich Schmid, TU Wien

Vice General Chair:
Markus Eberstein, TDK Sensors

Technical Organizing Committee:
Heli Jantunen, University of Oulu
Eung Soo Kim, Kyonggi University  
Soshu Kirihara, Joining and Welding Research Institute Osaka University  
Daniel Krueger, Honeywell  
Zhifu Liu, Shanghai Institute of Ceramics of the Chinese Academy of Sciences
Jens Müller, Technische Universität Ilmenau 
Uwe Partsch, Fraunhofer IKTS
Steve Dai, Sandia National Laboratories
Michael Schneider, TU Wien

Austrian Economic Chambers
Vienna, Austria

Local Conference Committee



    Program       Exhibition       Registration    

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost-effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities. 



Ceramic materials have numerous industrial applications thanks to their high chemical, mechanical, and thermal resistances. Precisely because of these reasons, producing parts with these materials is technically challenging with conventional subtractive manufacturing methods. Additive manufacturing is a promising alternative to fabricate ceramic parts with complex geometries. For example, pre-ceramic polymer resins are used in commercial light based Stereolithography printers (e.g 

We developed a volumetric printing technique that solidifies all layers simultaneously instead of the traditional layer by layer deposition. This opens us new avenues to print complex geometries without support structures. In particular, we applied volumetric printing to the fabrication of ceramic parts. During the talk, we will review recent Volumetric additive Manufacturing (VAM) methods and in particular describe the working principle of VAM by tomographic backprojection. We will show examples of fabricated complex centimeter scale Silicon Oxycarbide ceramics with excellent performance in terms of heat and chemical resistance.

Christophe Moser

Christophe Moser, EPFL

Associate Professor of Optics and Section Director in the Institute of Electrical and Microengineering


Andrés F. Lasagni, Technische Universität Dresden, Institute of Manufacturing Technology, Fraunhofer Institute for Material and Beam Technology IWS



The semiconductor industry is gradually approaching the end of Moore’s law. Which means that reducing the structure size on the silicon chip will stop to be the largest leverage to shrink the size of electronic components. Instead, heterogeneous packaging of active and passive components is becoming a major focus to maximize performance, optimize yield and shrink the size of electronic components. There are several material platforms for packaging like epoxy moulds, silicon wafers, advanced PCB materials or LTCC. But also, glass based packages are of interest for the industry and have a number of advantages. Glasses form a stiff substrate, which allows redistribution layers (RDL’s) with single micrometer accuracy. Glasses, adjusted with their thermal expansion, enable packages, which handle high thermal loads. Glasses can be structured with thousands of cut-outs for fan-out embedding of semiconductor components of passive components. Glasses are available at panel size, which can bring in a large cost advantages for larger packages. The dielectric properties of glasses allow building conductive connections with short delay times, low parasitic capacitances and good high frequency properties. Also, special glasses can be developed with minimized losses and with particular low dielectric constants for GHz applications like antenna in package concepts where even antenna arrays have to be integrated. In the current work we review the state of glass panel based packaging including industrial readiness over the whole process chain and show examples where glass has already shown its usefulness in packaging.

Martin Letz

Martin Letz, SCHOTT AG


Click here for full program details

  • Emerging Materials - Wednesday, July 13, 2022 - 2:15pm-4:45pm
  • Applications - Wednesday, July 13, 2022 - 2:15pm-4:45pm
  • Integrated Passive Devices - Thursday, July 14, 2022 - 10:30am-12:00pm
  • Conductor Technology - Thursday, July 14, 2022 - 10:30am-12:00pm
  • Advance Materials - Thursday, July 14, 2022 - 1:30pm-3:00pm
  • Process Technology - Thursday, July 14, 2022 - 1:30pm-3:00pm
  • Si-/LTCC-Compound Substrate Technology - Thursday, July 14, 2022 - 3:30pm-5:30pm
  • RF & Microwave - Thursday, July 14, 2022 - 3:30pm-5:30pm
  • Metallization Pastes - Friday, July 15, 2022 - 10:30am-1:00pm
  • Additive Manufacturing - Friday, July 15, 2022 - 10:30am-1:00pm




CICMT 2022 is expected to return as an on-site event. As an exhibitor, you will have the unique opportunity to market your products and services to a captive audience of buyers, designers, and influential researchers.

Our opening hours are arranged to give exhibitors maximum exposure, and coffee breaks are planned in the exhibition space to encourages all delegates to meet and mingle formally and informally. Spaces are available on a first-come-first-served basis. We will try to accommodate all of your special needs and requests.

Details about options and fees will be available shortly.




The prices for the conference tickets are as follows. The early registration fees end on June 8, 2022. 

Member early630,00 €
Member late750,00 
Non-Member early730,00 
Non-Member late840,00 
Exhibitors 6qm)1.900,00 

Every Exhibition Space comes with a table, two chairs and if necessary a power supply and pin board.

Click here for more information.


Novotel Suites Wien City Donau 
Radingerstraße 2, 1020 Wien, Österreich (17 minutes with the subway U1)

50 suites for single use at the price of 152,50€ including breakfast have been reserved for conference guests. Please find the booking form here and use the code CICMT 2022 to reserve a room.

Familienhotel Wien Leopoldstadt / Donau – Novotel Suites – ALL ( (


Ibis Budget Wien Messe
Lassallestraße 7, 1020 Wien, Österreich (19 miniutes with the subway U1)

50 rooms for single or double use at the price of 89,00€ – 97,50€ including breakfast have been reserved for conference guests. Please find the booking form here and use the code CICMT 2022 to reserve a room.

Günstiges Hotel Wien Messe – ibis budget – Accor – ALL (


Post Hotel Wien
Fleischmarkt 24, 1010 Wien, Österreich (14 minutes with the subway U1)

14 rooms for single or double use at the price of 139,00€ – 149,00€ including breakfast have been reserved for conference guests.

Home – Hotel Post Wien ( (


Bassena Wien Prater
Messestraße 2, 1020 Wien, Österreich (27 minutes with the subway U2 and the Tram 1)

A self demand number of rooms for single use has been reserved the price of 150,00€ including breakfast have been reserved for conference guests. Please use the link here to reserve a room at this price.

BASSENA Wien Messe Prater **** ( (


Photos courtesy of WienTourismus