Advanced SiP 2022 Conference Summary

June 20-23, 2022

DoubleTree by Hilton Sonoma - Wine Country

2022 IMAPS Advanced SiP Conference a Great Success in Sonoma

Mark Gerber

Mark Gerber, ASE (US) Inc.
Advanced SiP 2022 GENERAL CHAIR

Mark is Sr. Director of Engineering and Marketing at ASE (US) Inc., He provides technical support for customer activities around the world focused on 5G and Automotive segments with package platform focus areas including Flip Chip, Copper Pillar, Advanced RDL and SiP Packaging Technologies.  Mark has 25 years of semiconductor packaging experience working for Advanced Semiconductor Engineering-ASE, Texas Instruments, Motorola and Maxim Integrated in various areas of design, manufacturing and assembly with an emphasis on the development of new technologies and processes.  Mark has served as general chair for multiple conferences and led multiple committees for IMAPS and IEEE.  Mark was awarded the IMAPS Fellow title in 2018.  He holds a bachelor‘s degree in Mechanical Engineering from Texas A&M University, has written +20 papers and holds over 32 semiconductor packaging patents.

I want to thank all the participants, sponsor and exhibitors for supporting the IMAPS 2022 Advanced SiP Conference – we have received lots of positive feedback and here‘s a short recap of the event.  Please reach out to IMAPs if you were not able to attend and would like to obtain the presentation materials.

The technical program can be viewed at:

Day 0: We started off with a special HIR workshop with an outstanding list of keynotes and invited speakers that covered an intro to HIR, Integrated Photonics, Automotive Electronics, Thermal Management and Supply Chain.  This was followed by 3 PDC courses.  Excellent pre-conference event and a special thanks to Bill Chen and Bill Bottoms for the HIR workshop!!

Day 1: Kicked off with 2 keynotes - Chidi Chidambaram (Qualcomm) on System-level Optimization Opportunities and Challenges in the Era of Slowing Silicon Process Technology provided a nice look into the next generation heterogeneous requirements for the next generation of silicon nodes.   The second keynote was Ron Ho (Meta).  His talk Silicon SiPs for the Metaverse outlined a number of key miniaturization and performance challenges for AR/VR product space.  This was followed by a session of invited speakers Pouya Talebbeydokhti (Intel), Matthew Poulton (Quoro) and Mohamed Jatlaoui (Murata) discussing mobile/5G in the morning and an afternoon session on wearables/IOT from Curtis Zwenger (Amkor), Mark Poliks (Binghamton University) and Szi Pei Lim (Indium Corp.). The day capped off with a panel session led by Jan Vardaman (TechSearch International) on Remaining Challenges in the Adoption of 5G where several panelists participated including myself, Curtis Zwenger and Matthew Poulton.  It was a lively discussion around why there still seems to be some challenges with 5G both mmwave and sub6G.  A similar recap can be heard on 3D InCites by the Queen of 3D - Francois Von Trapp ( 

Day 2:  The Khai Nguyen (Nvidia) keynote Trends and Reliability Challenges in Advanced Driving Assistance System (ADAS) provided insight into key considerations for current and next generation ADAS systems that may use complex modules.  Anindya Poddar (Texas Instruments) presented on The Automotive Package Ecosystem. This keynote emphasized the need and value of heterogeneous integration and system solutions moving forward and the key ecosystem players that will be critical to enable.  An invited speaker session followed on HPC/CPO with talks covering next generation advanced fanout embedded bridge - Lihon Cao (ASE), hybrid bonding from Robert Patti (Nhanced Semi) and the path to sub fJ/Bit Interconnect Daniel Graf (Zero EC).  The afternoon focused on Automotive and Power with invited speakers from Hongbin Yu (Arizona State University) on Automotive Power Delivery, Pradeep Lall (Auburn University) on FCBGA underfill materials for Automotive, and Mike Marczi (Marel Power) with his talk on packaging beyond 100kW/L.   

The startup company competition had 4 companies pitching their technology - Averatek, Avicena, Mosaic Microsystems and Sivers Semiconductors (Mixcomm).  It was a tough competition and we congratulate the winner Haris Basit with Averatek! Finally, the day was closed with a panel round table led by Eelco Bergman (ASE) on Chiplet Based Architectures – the Road to Mass Adoption where he hosted 4 panelists that shared their insights to both current and future challenges with chiplet integration.

Day 3: The final day began with a keynote from Ming Zhang (Synopsis) who presented on Conducting the Semiconductors: The Role of Design in the SysMoore Era, followed by invited speakers John Park (Cadence) and Anthony Mastroianni (mMentor/Siemens) who provided their insight related to chiplet integration, as well as the ecosystem.  The last session featured 3 speakers on test considerations: Warren Wartel (Amkor), Wei Wang (National Instruments) and Ken Lanier (Teradyne). 

I want to thank the technical committee that helps to bring in the outstanding speakers and the IMAPS team, Brian Schieman and the IMAPS team for planning and organizing the venue.  Please check out for the 2022 International Symposium on Microelectronics that will be held in October in Boston, Mass.  Stay tuned for next year‘s 2023 IMAPS Advanced SIP Conference and Venue!!

SiP Day 1 Keynote

SiP Day 1 Panel

SiP Startup Competition Winner


SiP 2022 Technical Committee Members


SIP at SiP!  

Wine Tasting, Education & Networking

Thank you to our sponsor:

Sip at SiP participants  enjoyed a wine education experience led by Brian Schmaltz, tasting five delicious and unique wines, coupled with delicious food (artesian cheeses, vegetable crudite, various pastas, tri-tip steak, and more), all while networking with fellow conference attendees! Brian and Robin hand-selected five incredible wines for our attendees: 

  1. AC Rosé made from 100% Pinot Noir Sangiacomo Vineyards
  2. 2021 Chardonnay Sangiacomo Vineyard  (Barrel Sample, to be bottled this Summer)
  3. 2021 Pinot Noir Signal Ridge Vineyard  (Barrel Sample, to be bottled this Summer)
  4. 2018 Volume VI Napa Cabernet Sauvignon
  5. Special Vintage Napa Cabernet Sauvignon

SIP at SiP

SIP at SiP
SIP at SiP
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3D InCites
ASE Group
EMD Electronics
Indium Corp.

TechSearch International