IMAPS Student Membership provides the tools and resources you need to expand your expertise and start a career in microelectronics packaging.   

Publications

• Advancing Microelectronics Magazine digital access
• Access to the online Journal of Microelectronics and Electronic Packaging and IMAPS papers

Events and Speaking

• Enjoy discounts on IMAPS events: annual Symposium on Microelectronics and advanced technology workshops
• Free student booths an annual Symposium
• Speaking and publishing opportunities - no publishing fees!

 Professional Development

• Member discounts for online professional development courses available at the new IMAPS Academy

Connections

• Local chapter membership and activities. 
• Post resumes and search for jobs in the Jobs Marketplace
• Maintain your professional listing

Student Grants and Recognition
Win grants and awards through local chapter and national competitions

  Student Membership is FREE!  Students must sign up with student email and provide proof of student status.

 
Read about the highly successful student participation at the IMAPS Symposium 2023 in San Diego.

Student Spotlight ~ August 2024

Congratulations to the best student poster winners at the IMAPS Florida Chapter Workshop on August 28, 2024.  The top 3 winners received cash prizes and were able to network with chapter members and guests.

1st Place: Peeyush Awasthi & Anthony Giordano - Florida International University
In-line monitoring and process control with mm-Wave antenna sensors

2nd Place: Brenden Mears – University of Florida 
Electromagnetic Interference Absorbing Composites for 5G and 6G Heterogeneous Integration 

3rd Place: Veeru Jaiswal – Florida International University
Low-power magnetoelectric wireless telemetry system for multimodal sensing

 Student Awards ~ IMAPS Symposium 2023

Best Student Presentation Award at the 2023 IMAPS Symposium Tobias Tiedje (Technische Universität Dresden)		Paper: Stereolithographic process for embedding of electronic components into multi-material flexible and stretchable polymer substrate to reduce stress during stretching Tobias studied electrical engineering at Technical University Dresden and is now a PhD student at the Institute for Electronic Packaging at TU Dresden. His research focuses on embedding technologies of bare dies regarding materials and RDL processes.
Best Student Poster Award at the 2023 IMAPS Symposium Emma Pawliczak (Binghamton University)		Poster:  Conformal Silver Films for EMI Shielding of SiP Architectures Emma has a BS in Mechanical Engineering from SUNY Binghamton and is currently pursuing her Ph.D. in Mechanical Engineering at Binghamton University (Microfluidics and Multiphase Flow Laboratory). Her work includes using electrospray deposition (ESD) to generate thin films for electronics packaging. She prints thin polymeric (polyimide) films for package corrosion protection on 200 µm copper wires and 20 µm bond wires; recently, her work focuses on printing metallic (silver) films for electromagnetic interference protection of system-in-package architectures.
2023 IMAPS Steve Adamson Student Recognition Award Nicole Wongk (Rochester Institute of Technology)		The Steve Adamson Student Recognition Award honors an active student member‘s participation in IMAPS events, chapters, and programs. The judges also consider significant technical research and/or service contributions to IMAPS and the microelectronics industry. Nicole is a student at Rochester Institute of Technology, pursuing a Masters in Microelectronics Engineering.

Nicole Wongk talks about her IMAPS award experience, conferences and Professional Development Courses, networking and learning from exhibitors.

Student Spotlight ~ August 2023

On August 24, 2023, the IMAPS Florida Chapter held a Workshop on Heterogeneous Integration – System in Packaging.  The event included a judged Student Poster competition and we had a terrific turn out.  Congratulations to the top 3 winners who received financial awards from the Microelectronics Foundation!

1st place: Reshmi Banerjee 
Florida International University

Bio-photonic Sensor Integration in Flex Packages with Embedded Power and RF Functions

2nd place: Connor Watkins 
University of Florida

Very High Frequency Stability of Single-Crystal Silicon Thermal-Piezoresistive Resonators with Phase-Locked Loop

3rd place: Vishnu Shukla
University of Central Florida

A Comparison Study of Bi-Doping on Mechanical Properties and Fatigue Performance of SnAgCu405 and SnAgCu305 Solder Alloys