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The latest technologies related to the use of wire bonding in battery pack, semiconductor and microelectronic packaging
Don't miss this popular event on March 3-6 at our new Phoenix venue with an expanded program and larger, sold-out Exhibit Hall. Co-located with IMAPS Medical Microelectronics.
Covering medical microelectronic device technologies, products, strategies, markets and collaborations
Convenient Platform | Relevant Content
Speak
Get in front of the advanced packaging industry by speaking at a conference, workshop or local event.
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Network
Engage with industry professionals, researchers and students to learn, share insights and develop contacts.
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Publish
Publish an article in our Advancing Microelectronics magazine or a technical paper in the Journal.
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Learn
IMAPS is committed to providing various formats of workforce development and education.
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IMAPS is the premier, non-profit membership association steering the communities associated with Microelectronics Advanced Packaging, Interconnect and Assembly by providing channels for communicating, educating, and interacting within academia, industry and government. IMAPS leads the advancement and growth of the advanced packaging workforce through professional education, upskilling, and networking across the entire semiconductor supply chain, both in-person via conferences and on-site training, as well as on-demand through the new IMAPS Academy software portal.
Featured
Device Packaging Conference 2025
21st Annual - new venue in Phoenix, Arizona
March 3-6, 2025 | DevicePackaging.org
- Co-located with Advanced Packaging for
Medical Microelectronics Worshop (March 6-8) - Still accepting abstracts
EMMA PAWLICZAK
Microelectronic Foundation Steve Adamson Student Recognition Award
2024 IMAPS Society Award Winner
This award honors an active student member's participation in IMAPS events, chapters, and programs. Significant technical research and/or service contributions to IMAPS and the microelectronics industry are considered.
IMAPS Academy
Advanced Packaging Workforce Development
On-demand portal of semiconductor assembly and packaging courses taught by industry experts.
Congratulations to the winners of the Symposium drawing for a free course: Raphael Dijoud (MIT), Ashton Purcell (Powerex), Mark Fosberry (MITRE), Joey Law (U of WA) and Luc Belanger (Ciena).
