Technology Crossover Event Rescheduled
This event has been rescheduled for April 20-22, 2021.
Due to the continually evolving conditions surrounding COVID-19, the technology crossover extravaganza featuring the international conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), and Power Packaging has been postponed to April 20-22, 2021.
Speakers, sponsors, exhibitors and attendees will be contacted with relevant details about refunds and/or credits immediately.
Please contact firstname.lastname@example.org if you have any questions about this event.