Technology Crossover Event Rescheduled


This event has been rescheduled for April 20-22, 2021.

Due to the continually evolving conditions surrounding COVID-19, the technology crossover extravaganza featuring the international conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), and Power Packaging has been postponed to April 20-22, 2021.

Speakers, sponsors, exhibitors and attendees will be contacted with relevant details about refunds and/or credits immediately. 

Please contact if you have any questions about this event.