Dr. James Lu
Associate Professor
Department of Electrical, Computer, and Systems Engineering
Rensselaer Polytechnic Institute
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Dr. Lu has served as the 3D Packaging Chair of the IMAPS National Technical Committee since 2006. In this overall leadership role, James helps produce national IMAPS events. This is seen by his serving as the Technical Co-chair of the Device Packaging Conference since 2007, the Chair of the 3D Packaging Workshop since 2006, and as a Session Chair for International Symposiums since 2007.
Working closely with IMAPS staff and conference committee members, James organized the Society’s first 3D packaging workshop at 2006 Device Packaging Conference (DPC). James has benefitted from starting and producing these IMAPS conferences and workshops in a variety of ways such as planning events, moderating teleconferences, selecting papers, and designing technical programs.
“During my more than 10 years of research on 3D integration and IMAPS event participation, meeting fellow IMAPS members from around the world has allowed me to state my research case to important audiences, receive valuable feedback from my peers, and hear contrary perspectives,” James said. “I have learned a lot, made new friends, and hopefully advanced microelectronics and packaging technologies.” James encourages his students at RPI to participate in IMAPS events to learn new technologies and new ideas of future systems.
Many IMAPS leaders are thankful for Andrew Strandjord, Senior Manager of Advanced Packaging, at Pac Tech USA, for recruiting James to participate. Andrew conveys, “Since I brought him to IMAPS in 2005, James has been one of the most important members of the IMAPS technical community and a driving force behind the progress of 3D integration and packaging.”
James notes, “I am at home in the laboratory. And, I also take great joy in organizing and participating in IMAPS conferences, panels, sessions, and workshops.” “It’s valuable for me to interface with friends in the industry. This way I sharpen my understanding of the marketplace, R&D pipeline, and other related technologies.”
James has led many successful half-day professional development courses (PDCs). The most recent one was “Advances in 3D Integration and Packaging Technologies, Assessments, Status and Applications” at the IMAPS DPC in March 2009. He will teach it again at the DPC in early March 2010.
At Rensselaer Polytechnic Institute, James is an associate professor in the Department of Electrical, Computer, and Systems Engineering (ECSE), where he has been teaching a number of courses in micro-nano-electronics design, materials, devices, fabrication, and system integration. He is also associated with several university centers in micro-nano-elelctronics, energy, and systems integration. James has published more than 200 papers and articles in refereed journals and conferences.
James has been working to design the processes and architecture that could one day be the platform for 3D chips. His research spans a wide spectrum of 3D integration and packaging technologies, particularly 3D architecture and platforms, circuit design, material developments, micro-nano-processing technologies, and applications in memory, processor, mixed signals, power delivery, optical and electrical interconnects. His long-term research interests lie in 3D systems integration with photonics, nanotech, bio-MEMS, bio-engineering, bio-inspired devices, and information processing/computation.
“Based on the physics, technical and economic limits, CMOS device shrinkage may come to an end somewhere around the 22 nm node depending on device and structure.” “3D integration is one of th few avenues available to alleviate this problem and to accommodate scores of different components.” James notes.
James has been also traveling globally to give seminars to many companies, government labs, and universities to share his research advances and to promote 3D collaborations. His leadership on 3D research programs provided valuable reviews and discussions for many IC companies such as IBM, Intel, TI, AMD, Freescale Semiconductor, and SEMATECH. This has helped some of these companies start their own internal research programs to make successful components.
In his spare time, James and his wife Holly spend time to listen to their two daughters, Bettina and Angela, play violin and piano. James has been blessed to have his wife’s support for his busy work schedules. James enjoys gardening, sports and music.
James and his friends - 3D Practitioners – at the IMAPS 2008 Device Packaging Conference.
James with Rensselaer President Dr. Shirley Ann Jackson and Board Chairman Samuel F. Heffner Jr. in 2008 Trustee Celebration of Faculty Achievement.
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