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July 17, 2008

Draper Laboratory

Button IMAPS Elections Close In Two Weeks - Vote Today (read more...)

Button Abstracts Due in Two Weeks for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management (read more...)

Button RF and Microwave Packaging Workshop Program and Registration Now On-line (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) Begins July 28 (read more...)

Bullet Viking Chapter Summer Social - Chapter Member Appreciation Day at a St. Paul Saints Baseball Game (read more...)

Bullet IMAPS Nordic Conference 2008 Being Held September 14-16 - Program and Registration Now On-line (read more...)

Bullet XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference (read more...)

Bullet 7th International Symposium on Microelectronics and Packaging (ISMP 2008) (read more...)

Bullet IMAPS India Holding International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) (read more...)

Advancing Microelectronics July/August 2008 On-line Magazine is Now Available (read more...)

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Society News

IMAPS Elections Close In Two Weeks - Vote Today! 
IMAPS is now conducting its elections for national leadership and bylaw changes. Voting should take about five to ten minutes. Thank you in advance for your important participation. 

Please vote for candidates for IMAPS National offices. The general membership recruited and recommended the candidates. The IMAPS Nominating Committee, chaired by the President-Elect Doug Bokil, reviewed these candidates. IMAPS Executive Council approved the candidates.

In addition to voting for the candidates, you will also vote for Bylaw changes. The general membership must review and approve changes to the Bylaws of the Society. You can view/download the proposed bylaw changes at All proposed changes in the bylaws are noted by revision marks and comments.

Voting Instructions:
Ballots must be submitted on-line at Only one ballot will be counted per member.

Voting concludes on Thursday, July 31, 2008 at Noon EDT.

Please read the following instructions before you visit the website to cast your vote.

You will see one web page for each office. A brief biography of each candidate is included on each page. You may vote for only ONE of the candidates listed for each office by clicking on the circle button just above the candidate’s name. To abstain from voting for this office, do not click on any candidate's circle button. After you vote, click on the “Continue” button to proceed to the next office's web page.

After voting for the candidates and bylaw changes, you will see your completed ballot for your final approval. Please review the final ballot carefully; as once you have clicked on the "Cast My Votes" button you cannot change your votes.

If you have any problems during the voting process, please contact Brian Schieman at IMAPS Headquarters at 202-548-8715 or

Election results will be provided in the September/October and/or November/December issue(s) of Advancing Microelectronics, during IMAPS 2008 and on-line at New officers will begin their terms during the Annual Business Meeting of the Membership on Tuesday, November 4, at the Rhode Island Convention Center in Providence.
IMAPS Events (view full Web Calendar)

Abstracts Due in Two Weeks for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management   ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management is being held October 14-16, 2008, at the
Cabaña Hotel & Resort (A Crowne Plaza Resort) in Palo Alto, California.

For more information, visit This workshop will now feature a limited number of tabletop booths. Only one tabletop is still available so contact Ann today!

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutionsto meet current and evolving requirements in computing and wireless/telco systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

Abstracts are being requested in the following areas:

  • Market Drivers: Thermal challenges and drivers combined with market trends, market segment size, cost drivers, and performance and reliability requirements.
  • Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, and wireless/telco components and systems. Standards for reliability and testing.  Metallic, metal matrix and polymer matrix materials.
  • High Conductivity Materials: Metallic, ceramic and other composite materials with thermal conductivity equal to or higher than aluminum or copper, as well as thermal expansion closer to that of silicon and ceramic.
  • Device Packaging: Chip-level packaging, including System-On-Package, Multi-Chip Module and Multi-Package Module, thermal/interconnect concerns.
  • Liquid and Phase-Change Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
  • Refrigeration Cooling: Presentations on advances in alternative solutions as well as reliability, serviceability, and availability.
  • System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration paths from air to liquid cooling.         
  • Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
  • Telecommunications Systems: Component- and system-level thermal management solutions for high-performance telecommunications systems.
  • Consumer Electronics: Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.

Preparation of Abstracts:

Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 30, 2008.  No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 12, 2008.  A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted online at

Questions: contact Jackki Morris-Joyner with questions: or 305-382-8433. You may also contact the workshop chairs.

Contact Ann Bell at or 202-548-8717 for information about Tabletop exhibits.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

RF and Microwave Packaging Workshop Program and Registration Now On-line   ^ Top
This new Advanced Technology Workshop on RF and Microwave Packaging is being held September 16-18, 2008, at the Crowne Plaza Hotel in San Diego, California. To view the technical program and to register, visit

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. Sessions will be held on:

For more information, visit

Chapter Activities (events listed in chronological order)

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) Begins July 28    ^ Top

ICEPT-HDP will be held July 28-31, 2008, in Shanghai, China.
Sessions are being planned describing new development in the following themes:

Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SoP, SiP; 3D packaging, PoP, TSV; micro- & nano-system packaging; and other advanced packaging and system integration technologies.   

High Density Substrate & SMT: Embedded passives and active components; micro-via, micro-join, HDI, PCB, high performance multi-layer substrate; stencil print, reflow; and other novel assembly technologies that improve substrate density and performance.

Packaging Design and Modeling: Various new packaging/assembly designs; methods/technologies/software for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; chip-packaging-PCB co-design; and multi-function & scale modeling, simulation, validation methods/software.

Emerging Technologies: Sensors, actuators, MEMS, NEMS & MOEMS; optoelectronics & LED packaging; LCD, passive & RF devices, power & HV devices; nano-devices based on nano-wires, nano-tubes and polymers, etc.

Packaging Materials & Processes: New developments in bonding wires, solders, underfills, encapsulations, adhesives, thin films, dielectrics, substrate materials; green electronics materials, nanomaterials and other novel materials for packaging performance enhancement and cost reduction; and various packaging/assembly processes.

Packaging Equipment, Measurement & Characterization: New packaging/assembly equipment; new methods/ technologies/systems for quality monitoring, process control, failure inspection, performance characterization, and deformation measurement; and packaging equipment/ measurement techniques for emerging technologies.     

Advanced Manufacturing Technologies: Photolithography, laser processing; novel packaging/assembly technologies for manufacturability and yield improvement, cost reduction and service performance improvement; and methods/software for modeling and monitoring of process effectiveness & cost analysis.    

Quality & Reliability: Quality monitoring and evaluation for packaging/assembly; advanced methods/technologies/tools for rapid reliability data collection/analysis, reliability modeling & life prediction; reliability issues in various electronics packages; and new methods/technologies/tools for failure analysis.    

For more information, visit

Viking Chapter Summer Social - Chapter Member Appreciation Day at a St. Paul Saints Baseball Game    ^ Top

Date: August 14, 2008

4 pm to 7 pm tailgating
7:05 pm game starts

Midway Stadium
1771 Energy Park Drive
St. Paul, MN 55108
(651) 644 – 6659

Ticket price includes reserved seating for the game, pop and dinner at our pre-game tailgating party. IMAPS will provide food and beverages.

Members - Free
1 Guest per Member for $10
Non-Members and additional guests for $25


Contact Steve Block
Phone: 952-903-0333

Register On-line

IMAPS Viking Chapter is holding our second annual St. Paul Saints social outing. We will tailgate in the parking lot. IMAPS will provide food and beverages. We will keep you posted on Final Details for the event!!

IMAPS Nordic Conference 2008 Being Held September 14-16 - Program and Registration Now On-line    ^ Top
The annual IMAPS Nordic 2008 conference will take place in Denmark, September 14-16. The 2008 conference will be held at
the sea shore hotel Marienlyst, Helsingoer. The city Helsingoer with the famous Kronborg Castle has a direct train connection from the airport of Copenhagen.

A block of hotel rooms at the special IMAPS Nordic price has been reserved until July 14. After that date room reservations will be on space available basis. For information of prices and hotel contact details, please read more at:

The preliminary program can be found at:

The tutorial content can be found at:

The Registration page for conference, tutorial or exhibition can be found at:

The Exhibition Invitation can be found at:

XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference    ^ Top
We have the pleasure to invite you for XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference, which will be held in Pultusk (60 km from Warsaw) in The Polonia House in Pultusk - The Castle ( on 21-24 September 2008. For the first time, this Conference is organized by IMAPS Poland and Polish Chapter of IEEE CPMT with participation of Committee for Electronics and Telecommunication of Polish Academy of Science.

This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.

The Conference topics will include:

  • Hybrid and Semiconductor Technology
  • Design Methods and Computer Simulations
  • Electronics Materials and Components
  • Microcircuits Applications
  • Thick-Film and Thin-Film Sensors
  • Packaging and PCB
  • Quality and Reliability Evaluation
  • Thermal Management
  • Optoelectronics and Photovoltaics
  • Education in Electronics

The Conference presentations will be made in the form of:

  • Invited lectures
  • Poster sessions for presentation of contributed papers

All additional information concerning the Conference, you can find on our WEB pages, which are under preparation:

If you have any question please do not hesitate to contact us. The address for correspondence:

Ryszard Kisiel (responsible for Proceedings and Book of Abstracts)
Tel.: +48-22-234 78 52, Fax.: +48-22-234 87 40

Elżbieta Zwierkowska (Secretary of Organizing Committee)
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03

Małgorzata Jakubowska
Tel. +48-22-8353041 ext.457, Fax.:  +48-22 834 90 03

7th International Symposium on Microelectronics and Packaging (ISMP 2008)    ^ Top
The IMAPS-Korea organizing committee is very pleased to announce the 7th International Symposium on Microelectronics and Packaging (ISMP 2008) that will be held in Seoul during October 15-17, 2008.
The topics of the year will be in the area of the followings:

  1. Automotive Electronics, Telematics, MEMS, Power3-D, Embedded SubstrateCu/Low k, Wafer Level
  2. LED, Solar cell

For more information, please contact or visit

IMAPS India Holding International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08)    ^ Top

Date: December 15-18, 2008

December 15: pre-conference one-day Tutorial/Workshop discuss
December 16-18: Conference and Exhibition

JRD Tata Auditorium
National Institute of Advanced Studies [NIAS]
Indian Institute of Science [IISc] Campus
Bangalore-560 012, India

1. Conference:
General - Rs 3500/$350
IMAPS [India Chapter] Members - Rs 2500
Students - Rs 1000
Authors - Rs 2500 / $250

2. Tutorial / Workshop:
General - Rs 2000 / $200
IMAPS [India Chapter] Members - Rs 1500
Students - Rs 1000

Time Table:
Submission of Abstract : 7/31/2008
Intimation of Acceptance : 10/9/2008
Submission of Full Text Paper (Camera ready) : 11/1/2008
Paper presentation : At the Conference

Micro Systems : Design to Manufacturing

The IMAPS INDIA Chapter is organizing an International Conference on “Emerging Microelectronics and Interconnection Technologies, EMIT-08”- from December 16 to 18, 2008, at Bangalore, India. A pre¬conference one day Tutorial / Workshop on latest technologies such as MEMS, MEOMS, VLSI Design, Hybrid Microelectronics is planned on December 15, 2008.

The Research & Development activities in Miniaturization, Design, Production Processes, Packaging and Applications of Monolithic, Thick and Thin Film Hybrid Microelectronics, Nano Electronics and Molecular Electronics, have made tremendous progress in the past decade. The VLSI Technology has given way to ULSI, and has already reached Nano¬metric scale (nm), 65 nm levels in production and less than 45 nm levels in R & D.

IMAPS India Chapter has been successfully organizing National and International Conferences in these areas and has received very good response earlier. EMIT 1996, 1998, and 2000 at Bangalore and all National Conferences held every year at various cities in India have seen very enthusiastic participation from leading Research & Academic Institutions and Industry.

To continue this tradition and to showcase all the new developments in the areas of Micro, Nano Electronics and allied fields, IMAPS India Chapter is organizing this International Conference, with the theme of Micro Systems: Design to Manufacturing, giving an opportunity to all researchers, academia and industry leaders to exchange latest information. Prior to the conference one day Tutorial / Workshop is scheduled by experts in the appropriate areas.

These events provide an excellent opportunity to the Scientists, Engineers, Technologists, Academicians and Industrialists to present papers and discuss in the areas of Microelectronics, Nano Electronics, Molecular Electronics & Electronic Packaging. The EMIT-08 will cover the presentations of the results of Research Findings, Developmental activities, Production Planning, Manpower Training, Establishment of Facilities, as well as, exchange of ideas on the state-of-art topics.

The venue of the Conference is at within idyllic surroundings providing an excellent ambience and ensuring good exchange of ideas and innovations as it is located at the highly rated Academic Institute in India.


Authors are invited to send original, unpublished papers for the EMIT-08. Authors are requested to send Abstracts of their papers in 300 to 500 words on any of the topics mentioned below by email ( so as to reach the IMAPS, India chapter, latest by July 31,2008. For more information, visit

Invited Talks / Special Talks:

Conference will also have Invited Talks from Experts in Specific Areas of Topical Interest. Some selected papers presented at other IMAPS Conferences in 2008 will also be invited to be presented at EMIT 2008 for the larger benefit of participants who could not attend them.

Suggested Topics, but not limited to:

In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].

Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.

Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like.

Products and Publications

Advancing Microelectronics July/August 2008 On-line Magazine is Now Available   ^ Top
The July/August issue of Advancing Microelectronics on Materials and Thermal Management is now available on-line.
View the July/August 2008 issue on-line today.

Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website. Non-members of IMAPS may also view the archived issues on-line. Non-members must join IMAPS or pay a download fee of $15 to access the current issue on-line.


CAD Design Software

Ticona Engineering Polymers

Oneida Research Services

ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA

ATW and Tabletop Exhibition on Thermal Management
October 14-16, 2008
Palo Alto, CA

*Exhibitors contact

IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact

ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL

*Exhibitors contact

Device Packaging Conference and Exhibition
March 9-12, 2009
Scottsdale/Ftn. Hills, AZ

*Exhibitors contact

CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO

*Exhibitors contact

ATW on Automotive Microelectronics and Packaging
May 5-7, 2009
Dearborn, MI

^ Top

Compex Corp


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