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Hotel Deadline September 15 for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management ^
Top The technical program is being finalized this week. Sessions/presentations are planned in the following areas:
For more information, visit www.imaps.org/thermal. This workshop will now feature a limited number of tabletop booths. Tabletop space has sold out! Device Packaging 2009 Conference and Exhibition - Flip Chip Technologies Workshop ^
Top The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3-D Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Chip Scale Packaging; Electronics Packaging for Biomedical Devices; and Packaging and Application of Power LED Devices (new in 2009) The objective of the Flip Chip Technologies Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Flip Chip packaging and associated Pb-Free implementation challenges. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Flip Chip. Attendees and presenters in the past have found that the Flip Chip Technologies Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry. If you are working in any area of electronics packaging or microelectronics, the Workshop on Flip Chip Technologies would be well worth attending. Abstracts are being requested on the following topics:
Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than September 26, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions. Device Packaging Exhibit and Technology Show: Device Packaging Professional Development Courses (PDCs): IMAPS 2008 Advance Program and Registration Now Available! ^
Top 19 Professional Development Courses will be held on Sunday, November 2 and Monday, November 3. The technical sessions and exhibition open on Tuesday and run through Thursday at noon. IMAPS 2008 also features: keynotes from Dr. John Zolper, Vice President of Raytheon Company, and the Honorable Donald L. Carcieri, Governor of Rhode Island; an Interactive Poster Forum; two Translated Sessions; a Global Business Council Marketing Forum on Alternative Energy: Options, Supply Chains, and Industry Trends; an Alternative Energy Panel Discussion; an enhanced Student Program; and a State-of-the-Art Exhibition and Technology Showcase. Learn more about IMAPS 2008 and register on-line at www.imaps2008.org. |
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| Chapter Activities (events listed in chronological order) | ||||||||||||||||||||
Arizona Chapter Lunch Meeting September 11 on MEMS Packaging Overview and Activities at Amkor ^
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MEMS Packaging Overview and Activities at Amkor In recent years, the MEMS devices have witnessed an explosive growth in market size, as well as the number of applications. Areas as diverse as automotive, gaming, mobile communications, display, printing, fiber optics, and biomedical have benefited from the integration MEMS technology. As most MEMS devices are based on silicon wafer process technology, it is only natural for semiconductor companies, design houses, and wafer foundries to jump on the MEMS bandwagon. In this presentation, a high-level overview of the packaging aspects of MEMS will be discussed. Issues including the similarities/dissimilarities of MEMS vs. Si, existing package platforms with potential MEMS application, cost drivers, and current MEMS activity examples at Amkor will be reviewed. Presented by: Bob Kuo received his Bachelor’s degree in Mechanical Engineering from National University of Taiwan, before he continued his pursue of graduate degrees in Materials Science (MS 1987, Ph.D.1993) at University of Rochester, NY. He spent 5 years with Polaroid Corp. in Boston area, in charge of optical metrology and new product development. Opportunity in working with Intel on their first CMOS camera optic module and warm weather lured him and his family to relocate in Tucson and joining Applied Image, Optics in 1997. His assignments there included managing the metrology group and then new business development. With the team Bob helped develop the world’s first plastic turn signal lens, first diffractive lens for digital imaging, first plastic lens for PC camera, and first plastic lens for cell phone camera modules. He left the company in pursue of consulting career, landing contracts in China, Taiwan, Singapore, and US. He joined Amkor in 1995 and is currently working as Director of Advanced Package Development, responsible for MEMS and photonics packages. IMAPS Nordic Conference 2008 Being Held September 14-16 - Program and Registration Now On-line ^
Top A block of hotel rooms at the special IMAPS Nordic price was reserved until July 14. Room reservations are now on space available basis. For information of prices and hotel contact details, please read more at: http://www.imaps.org/chapters/europe/nordic/Past.asp. The preliminary program can be found at: http://www.imaps.org/chapters/europe/nordic/Programme%20092.pdf. The tutorial content can be found at: http://www.imaps.org/chapters/europe/nordic/LTCC_tutorial_IMST.pdf The Registration page for conference, tutorial or exhibition can be found at:http://www.imapsnordic.org/registrations/ The Exhibition Invitation can be found at: http://www.imaps.org/chapters/europe/nordic/Exhibition%20letter%202008-draft%20c.pdf XXXII International Microelectronics and Packaging IMAPS-CPMT Poland Conference ^
Top This year our meeting is organized by the Warsaw University of Technology and Institute of Electronic Materials Technology in cooperation with Committee for Electronics and Telecommunication of Polish Academy of Science.The Conference topics will include:
The Conference presentations will be made in the form of:
All additional information concerning the Conference, you can find on our WEB pages, which are under preparation: http://imaps2008.imio.pw.edu.pl. If you have any question please do not hesitate to contact us. The address for correspondence:Ryszard Kisiel (responsible for Proceedings and Book of Abstracts) 7th International Symposium on Microelectronics and Packaging (ISMP 2008) ^
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For more information, please contact imapsk@imapsk.or.kr or visit http://www.imapsk.or.kr. Call for Paper Extended to September 15 for IMAPS India's International Conference on Emerging Microelectronics and Interconnection Technology (EMIT-08) ^
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Micro Systems : Design to Manufacturing "CALL FOR PAPERS”Extended to September 15, 2008 : Authors are invited to submit original, unpublished papers for the EMIT-08 until September 15, 2008. If you are interested in submitting an abstract of 300 to 500 words on any of the topics mentioned below, email (joshi610@yahoo.com) immediately. For more information, visit www.imapsindia.org. Suggested Topics, but not limited to: In the area of Design to Manufacturing the Microelectronics like: Advanced and latest Trends / Techniques in Design, Simulation, Fabrication and testing of Very Large Scale Integrated Circuits & Ultra Large Scale Integrated Circuits [for ASICs, Microprocessors, Large density memories, FPGAs etc].Issues related to PGA, Flat packs, BGA, Flip chip, LCC, custom specific modules, 3D packaging etc., w.r.t. material processes, thermal & mechanical analyses manufacturing processes etc.Hardware / software IP cores in sub¬micron geometry devices. MEMS as Sensors, Transducers, LEDs, RF applications, Piezoelectric Devices, Optoelectronic and SAW Devices. Application of micro, nano electronic materials and their fabrication facilities / industries in India and opportunities for Indian firms in the global markets etc. Issues covering generation of test vectors, development of test equipment hardware, R&QA and the like. IMAPS France - 4th European ATW on Micropackaging and Thermal Management ^
Top In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components. The workshop's sessions will include the following topics and papers are invited in these areas:
Deadline for submitting papers is November 5, 2008. Authors must submit a 200-300 word abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions). For more information, visit www.imapsfrance.org or contact Florence Vireton at imaps.france@imapsfrance.org. IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging ^
Top Prof Nihal Sinnadurai EMPC 2009 - European Microelectronics and Packaging Conference ^
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| Products and Publications | ||||||||||||||||||||
Advancing Microelectronics September/October
2008 On-line Magazine is Now Available ^
Top Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website. Non-members of IMAPS may also view the archived issues on-line. Non-members must join IMAPS or pay a download fee of $15 to access the current issue on-line. |
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Hotel Deadline September 15 for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management (
ATW on RF and Microwave Packaging
September 16-18, 2008
San Diego, CA
ATW and Tabletop Exhibition on Thermal Management
October 14-16, 2008
Palo Alto, CA
*Exhibitors contact abell@imaps.org
IMAPS 2008 - Providence 11/2/2008 - 11/6/2008
Providence, RI
*Exhibitors contact abell@imaps.org
ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL
*Exhibitors contact abell@imaps.org
Device Packaging Conference and Exhibition
March 9-12, 2009
Scottsdale/Ftn. Hills, AZ
*Exhibitors contact abell@imaps.org
CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO
*Exhibitors contact abell@imaps.org
ATW on Automotive Microelectronics and Packaging
May 5-7, 2009
Dearborn, MI
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