| COMMITTEE |
FIRST
NAME |
LAST
NAME |
COMMITTEE
POSITION |
COMPANY |
E-MAIL |
WORK
PHONE |
| 01-Emerging Technologies |
Susan |
Bagen |
|
Endicott Interconnect Technologies |
Susan.Bagen@eitny.com |
972-839-7465 |
| 01-Emerging Technologies |
Benson |
Chan |
|
Endicott Interconnect |
benson.chan@eitny.com |
|
| 01-Emerging Technologies |
Rajen |
Chanchani |
Co-Chair |
Sandia National Laboratories |
chanchr@sandia.gov |
505-844-3482 |
| 01-Emerging Technologies |
Linas |
Jauniskis |
|
Foster-Miller |
ljauniskis@foster-miller.com |
|
| 01-Emerging Technologies |
Chunho |
Kim |
|
Intel Corporation |
chunho.kim@intel.com |
480-554-8305 |
| 01-Emerging Technologies |
Luu |
Nguyen |
|
National Semiconductor Corp. |
luu.nguyen@nsc.com |
408-721-4786 |
| 01-Emerging Technologies |
Richard |
Sigliano |
|
Kyocera America |
rick.sigliano@kyocera.com |
|
| 01-Emerging Technologies |
Changhan Hobie |
Yun |
|
Qualcomm, Inc. |
cyun@qualcomm.com |
858-651-5449 |
| 02-Alternative Energy: Photovoltaics Batteries |
John |
Olenick |
|
ENrG |
jolenick@enrg-inc.com |
716-390-6740 |
| 03-Printed Devices and Applications |
Kenneth |
Church |
|
nScrypt |
kchurch@nscryptinc.com |
407-275-4727 |
| 03-Printed Devices and Applications |
Tim |
Davis |
|
JDM Associates |
timdavis1966@att.net |
407-275-0057 |
| 03-Printed Devices and Applications |
Carol |
Gamlen |
|
Harris Corporation |
cgamlen@harris.com |
321-727-6764 |
| 03-Printed Devices and Applications |
Mike |
Hudgens |
|
Corwil |
mhudgens@corwil.com |
mhudgens@corwil.com |
| 03-Printed Devices and Applications |
Mike |
McEntee |
|
Sypris Test and Measurement |
mike.mcentee@sypris.com |
407-551-2720 |
| 03-Printed Devices and Applications |
Mike |
Newton |
Chair |
nScrypt |
mnewton@nscryptinc.com |
407-275-4728 |
| 03-Printed Devices and Applications |
Andy |
Tseng |
|
ASE US |
Andy.Tseng@aseus.com |
|
| 04-High Power LEDs |
Gene |
Dunn |
Chair |
|
dunng@us.panasonic.com |
847-288-4409 |
| 04-High Power LEDs |
Frank |
Wall |
|
Philips Lumileds Lighting Company |
frank.wall@philips.com |
408-964-5212 |
| 05-Reliability |
Mudasir |
Ahmad |
|
Cisco |
muahmad@cisco.com |
|
| 05-Reliability |
Kuoning |
Chiang |
|
|
knchiang@pme.nthu.edu.tw |
|
| 05-Reliability |
Reza |
Ghaffarian |
|
Jet Propulsion Laboratory-NASA-CIT |
reza.ghaffarian@jpl.nasa.gov |
818-354-2059 |
| 05-Reliability |
F. Patrick |
McCluskey |
Chair |
University of Maryland |
mcclupa@eng.umd.edu |
301-405-0279 |
| 05-Reliability |
Ilyas |
Mohammed |
|
Tessera |
imohammed@tessera.com |
|
| 05-Reliability |
Ephraim |
Suhir |
|
UC at Santa Cruz, EE Dept. |
suhire@aol.com |
650-969-1530 |
| 05-Reliability |
Jin |
Yu |
|
KAIST |
jinyu@kaist.ac.kr |
|
| 06-Modeling and CAD |
Krystyna |
Semkow |
|
IBM |
semkow@us.ibm.com |
|
| 07-Manufacturing, Automation, Test and Process Control |
Daniel |
Grossman |
|
Rockwell Collins |
degrossm@rockwellcollins.com |
319-295-8709 |
| 07-Manufacturing, Automation, Test and Process Control |
Voya |
Markovich |
|
Endicott Interconnect Technologies |
voya.markovich@eitny.com |
607-755-1978 |
| 07-Manufacturing, Automation, Test and Process Control |
Soren |
Noerlyng |
|
Micronsult |
noerlyng@micronsult.dk
|
45-4465-1457 |
| 08-Thermal Management |
Herman |
Chu |
|
Cisco Systems |
hchu@cisco.com |
408 525-1210 |
| 08-Thermal Management |
David |
Copeland |
|
Oracle |
david.copeland@oracle.com |
650-938-2256 |
| 08-Thermal Management |
Virgil |
Ganescu |
|
Harrisburg Area Community College |
vcganesc@hacc.edu |
717-221-1300 |
| 08-Thermal Management |
Seth |
Homer |
|
Indium Corporation |
shomer@indium.com |
|
| 08-Thermal Management |
Eric |
Huenger |
|
Rohm & Haas |
ehuenger@rohmhaas.com |
|
| 08-Thermal Management |
David |
Saums |
Chair |
DS and A, LLC |
dsaums@dsa-thermal.com |
978-499-4990 |
| 09-System Level Packaging |
Munawar |
Ahmad |
|
Molex, Inc. |
Munawar.Ahmad@molex.com |
501-851-4850 |
| 09-System Level Packaging |
Ray |
Alexander |
|
Teradata or Independent Consultant |
check6x@sbcglobal.com |
760-749-1302 |
| 09-System Level Packaging |
Mitchell |
Ferrill |
|
IBM |
ferrill@us.ibm.com |
607-429-3040 |
| 09-System Level Packaging |
Mark |
Hoffmeyer |
|
IBM Systems and Technology Group |
hoffmeyr@us.ibm.com |
|
| 09-System Level Packaging |
James |
Knighten |
|
Teradata Corporation |
jim.knighten@teradata.com |
858-485-2537 |
| 09-System Level Packaging |
Sarosh |
Patel |
Chair |
Consultant |
sarosh.patel@stanfordalumni.org |
408-733-8731 |
| 09-System Level Packaging |
Karen |
Shrier |
|
Electronic Polymers Inc. |
kshrier@electronicpolymers.com |
512-583-8300 ext. 1101 |
| 09-System Level Packaging |
Arv |
Sinha |
|
IBM |
sinha@us.ibm.com |
507-253-4085 |
| 09-System Level Packaging |
David |
Swenson |
|
Affinity Static Control Consulting LLC |
static2@swbell.net |
512-244-7514 |
| 09-System Level Packaging |
Robert |
Vermillion |
|
RMV Technology Group LLC |
bob@esdrmv.com |
925-673-0225 |
| 10-Extreme Environments |
Fred |
Barlow |
|
University of Idaho |
fbarlow@uidaho.edu |
208-669-1008 |
| 10-Extreme Environments |
R. Wayne |
Johnson |
Co-Chair |
Auburn University |
johnsr7@auburn.edu |
334-844-1880 |
| 10-Extreme Environments |
Anwar |
Mohammed |
|
Huawei Technologies |
amohammed@huawei.com |
408-666-3913 |
| 10-Extreme Environments |
Rajeshuni |
Ramesham |
Co-Chair |
Jet Propulsion Laboratory |
rajeshuni.ramesham@jpl.nasa.gov |
818-354-7190 |
| 11-Military |
Terry |
Baum |
|
L-3 Communications Cincinnati Electronics |
terry.baum@l-3com.com |
513-573-6425 |
| 11-Military |
Greg |
Caswell |
Chair |
DfR Solutions LLC |
gcaswell@dfrsolutions.com |
|
| 11-Military |
Carolynn |
Drurik |
|
Defense Microelectronics Activity (DMEA) |
drudik@dmea.osd.mil |
916-231-1559 |
| 11-Military |
Thomas |
Green |
Co-Chair |
TJ Green Associates LLC |
tgreen1@ptd.net |
610-861-4572 |
| 11-Military |
Weiler |
James |
|
Northrop Grumman |
james.weiler@ngc.com |
818-715-4781 |
| 11-Military |
Arne |
Knudsen |
|
Kyocera America |
arne.knudsen@kyocera.com |
858-576-2751 |
| 11-Military |
Goetz |
Martin |
|
Northrop Grumman |
mgoetz3@live.com |
410-765-7199 |
| 12-Automotive |
Pradeep |
Lall |
|
Auburn University |
lall@eng.auburn.edu |
|
| 12-Automotive |
Gifford |
Plume |
|
Sensata Technologies |
gplume@sensata.com |
508-236-3914 |
| 12-Automotive |
Larry |
Rexing |
|
Heraeus TFD |
larry.rexing@heraeus.com |
610-825-6050 |
| 12-Automotive |
Adam |
Schubring |
Chair |
Kyocera America, Inc. |
adam.schubring@kyocera.com |
(248) 358-5200 ext. 225 |
| 13-NanoTechnologies |
Ajay |
Malshe |
|
Univesity of Arkansas |
apm2@engr.uark.edu |
479-575-6561 |
| 13-NanoTechnologies |
Jerry |
Sergent |
|
Fairfield University |
jsergent@mail.fairfield.edu |
203-254-4000 |
| 14-Ceramics LTCC (Thick/Thin Film/Hybrids) |
Michael |
Ehlert |
|
Barry Industries Inc. |
mike.ehlert@barryind.com |
949-929-4933 |
| 14-Ceramics LTCC (Thick/Thin Film/Hybrids) |
Dan |
Krueger |
|
Honeywell Solid State Electronics Center |
dkrueger@kcp.com |
816-997-2701 |
| 14-Ceramics LTCC (Thick/Thin Film/Hybrids) |
John |
Menaugh |
Chair |
DuPont Microcircuit Materials |
john.r.menaugh@usa.dupont.com |
303-279-5677 |
| 14-Ceramics LTCC (Thick/Thin Film/Hybrids) |
Ken |
Peterson |
|
Sandia National Lab. |
peterska@sandia.gov |
505-845-8549 |
| 14-Ceramics LTCC (Thick/Thin Film/Hybrids) |
Larry |
Zawicki |
|
Honeywell International, Inc. |
lzawicki@kcp.com |
816-997-4150 |
| 15-Interconnects (SMT and Wirebonding) |
Daniel |
Evans |
|
Palomar |
devans@bonders.com |
760-931-3641 |
| 15-Interconnects (SMT and Wirebonding) |
George |
Harman |
|
NIST |
george.harman@nist.gov |
301-975-2097 |
| 15-Interconnects (SMT and Wirebonding) |
Joe |
Kuczynski |
|
IBM |
kuczynsk@us.ibm.com |
507-253-0746 |
| 15-Interconnects (SMT and Wirebonding) |
Lee |
Levine |
Chair |
Process Solutions Consulting |
levilr@ptd.net |
610-285-6367 |
| 15-Interconnects (SMT and Wirebonding) |
Amanda |
Mikhail |
|
IBM |
amikhail@us.ibm.com |
|
| 15-Interconnects (SMT and Wirebonding) |
Mark |
Plucinski |
|
IBM |
plucinsk@us.ibm.com |
507-253-6010 |
| 15-Interconnects (SMT and Wirebonding) |
Bruce |
Romenesko |
|
The Johns Hopkins University/APL |
bruce.romenesko@jhuapl.edu |
240-228-8065 |
| 15-Interconnects (SMT and Wirebonding) |
Peter |
Sexton |
|
Technic, Inc. |
petersexton@alum.mit.edu |
401-769-7000 |
| 15-Interconnects (SMT and Wirebonding) |
Yoon Chul |
Son |
|
Samsung |
yoonchul.son@samsung.com |
|
| 15-Interconnects (SMT and Wirebonding) |
Patrick |
Story |
|
|
patrick.story@yahoo.com |
303-818-0261 |
| 15-Interconnects (SMT and Wirebonding) |
Youg-Bin |
Sun |
|
Kyonggi University |
ybsun@kgu.ac.kr |
82-31-249-9045 |
| 15-Interconnects (SMT and Wirebonding) |
Faina |
Zaslavsky |
|
Crane Electronics Group |
faina.zaslavsky@craneae.com |
425-895-5079 |
| 16-Substrates (PWB/FlexCircuits/Laminates) |
Hassan |
Hashemi |
Co-Chair |
Conexant Systems, Inc. |
hsn_hashemi@yahoo.com |
949 579 4756 |
| 16-Substrates (PWB/FlexCircuits/Laminates) |
Ron |
Jensen |
|
Honeywell Solid State Electronics Center |
ronald.jensen@honeywell.com |
612-954-2465 |
| 16-Substrates (PWB/FlexCircuits/Laminates) |
Roger |
Krabbenhoft |
|
IBM |
rkrabben@us.ibm.com |
|
| 17-Integrated Passives |
Woong Sun |
Lee |
|
|
woongsun.lee@gmail.com |
|
| 17-Integrated Passives |
Young Bae |
Park |
|
Andong |
ybpark@andong.ac.kr |
|
| 17-Integrated Passives |
Len |
Schaper |
Chair |
University of Arkansas |
schaper@uark.edu |
479-575-8408 |
| 18-Power Packaging |
Herbert |
Dwyer |
|
Herb Dwyer Associates |
herbdwyer1@aol.com |
508-251-1336 |
| 18-Power Packaging |
Douglas |
Hopkins |
Chair |
University at Buffalo |
d.hopkins@IEEE.org |
607-729-9949 |
| 18-Power Packaging |
Ricky |
Lee |
|
Hong Kong University of Science and Technology |
Rickylee@ust.hk |
|
| 19-Materials |
Susan |
Chen |
|
LORD Corporation |
yanshu.chen@lord.com |
|
| 19-Materials |
Jeff |
Gotro |
|
Innocentrix LLC |
jgotro@innocentrix.com |
949-635-6916 |
| 19-Materials |
Young Ho |
Kim |
|
Hanyang |
kimyh@hanyang.ac.kr |
|
| 19-Materials |
Sang Ha |
Kim |
|
|
sangha_kim@apple.com |
|
| 19-Materials |
John |
Lau |
|
Hong Kong University of Science and Technology |
johnlau@ust.hk |
|
| 19-Materials |
Li |
Li |
|
Cisco |
lili2@cisco.com |
|
| 19-Materials |
Wenning |
Liu |
|
Pacific Northwest Lab |
wenning.liu@pnl.gov |
|
| 19-Materials |
Andy |
London |
|
Heraeus Incorporated |
andy.london@heraeus.com |
610-825-6050 |
| 19-Materials |
Ilyas |
Mohammed |
|
Tessera |
imohammed@tessera.com |
|
| 19-Materials |
Herbert |
Neuhaus |
Chair |
Scimaxx Solutions |
herb@scimaxx.com |
719-638-5930 |
| 19-Materials |
Sara |
Paisner |
|
LORD Corporation |
sara.paisner@lord.com |
|
| 19-Materials |
Jianbiao "John" |
Pan |
|
California Polytechnic State University |
pan@calpoly.edu |
805-756-2540 |
| 19-Materials |
Raymond |
Pearson |
|
Lehigh University |
rp02@lehigh.edu |
610-758-3857 |
| 19-Materials |
George |
Sears |
|
LORD Corporation |
george.sears@lord.com |
|
| 19-Materials |
Frank |
Shi |
|
University of California - Irvine |
fgshi@uci.edu |
949-824-5362 |
| 19-Materials |
Jae Yong |
Song |
|
KAIST |
jysong@kriss.re.kr |
|
| 19-Materials |
Yan |
Zhang |
|
Tessera |
yzhang@tessera.com |
|
| 20-MEMS |
Alissa |
Fitzgerald |
|
|
amf@amfitzgerald.com |
|
| 20-MEMS |
David |
Galipeau |
Co-Chair |
South Dakota State University |
david_galipeau@sdstate.edu |
605-688-4618 |
| 20-MEMS |
Richard |
Gehman |
|
Honeywell Sensing and Control |
dick.gehman@honeywell.com |
614-850-5000 ext 7235 |
| 20-MEMS |
Ken |
Gilleo |
|
ET-Trends LLC |
ken@et-trends.com |
401-822-1399 |
| 20-MEMS |
David |
Seeger |
|
Semiconductor Research Corp. |
David.Seeger@src.org |
|
| 21-Wafer Bumping (Flipchip/CSP) |
Linda |
Bal |
Chair |
Freescale Semiconductor |
linda.bal@freescale.com |
|
| 21-Wafer Bumping (Flipchip/CSP) |
Bahareh |
Banijamali |
|
Xilinx |
bahareh.banijamali@xilinx.com |
|
| 21-Wafer Bumping (Flipchip/CSP) |
Zhongping |
Bao |
|
Qualcomm |
abao@qualcomm.com |
|
| 21-Wafer Bumping (Flipchip/CSP) |
Robert |
Forman |
|
Rohm & Haas |
RSF1@ix.netcom.com |
|
| 21-Wafer Bumping (Flipchip/CSP) |
Robert |
Hubbard |
|
Lambda Technologies, Inc. |
bhubbard@microcure.com |
480-981-0366 |
| 21-Wafer Bumping (Flipchip/CSP) |
Beth |
Keser |
|
Qualcomm, Inc. |
beth@qualcomm.com |
858-658-3332 |
| 21-Wafer Bumping (Flipchip/CSP) |
Lyndon |
Larson |
|
Dow Corning Electronics |
lyndon.larson@dowcorning.com |
989-496-5048 |
| 21-Wafer Bumping (Flipchip/CSP) |
Lou |
Nicholls |
Co-Chair |
Amkor Technology |
lnich@amkor.com |
480-821-5000 |
| 21-Wafer Bumping (Flipchip/CSP) |
Ricky |
Reed |
|
|
|
|
| 21-Wafer Bumping (Flipchip/CSP) |
Theodore |
Tessier |
Chair |
FlipChip International |
ted.tessier@flipchip.com |
602-431-4764 |
| 21-Wafer Bumping (Flipchip/CSP) |
Thorsten |
Teutsch |
|
PacTech |
teutsch@pactech-usa.com |
408-588-1925 |
| 21-Wafer Bumping (Flipchip/CSP) |
Michael |
Toepper |
|
Fraunhofer IZM |
toepper@izm.fhg.de |
+49-(0)30-4640-3603 |
| 21-Wafer Bumping (Flipchip/CSP) |
Hong |
Yang |
|
Applied Micro Circuits Corporation |
hyang@amcc.com |
858-535-6570 |
| 21-Wafer Bumping (Flipchip/CSP) |
Tim |
Younger |
|
IBM |
tpyoung@us.ibm.com |
|
| 22-Photonics/Optoelectronics |
John |
Bolger |
|
Department of Defense |
john.p.bolger@ugov.gov |
|
| 22-Photonics/Optoelectronics |
Min |
Ding |
|
Freescale |
min.ding@freescale.com |
|
| 22-Photonics/Optoelectronics |
Sunny |
Liu |
|
|
sangliu@huawei.com |
|
| 22-Photonics/Optoelectronics |
John |
Mazurowski |
Chair |
Penn State Unversity - Electro-Optics Center |
jmazurowski@eoc.psu.edu |
724-295-7000 ext. 7139 |
| 23-Copper/Low-K |
John |
Tork |
|
IBM |
jtorok@us.ibm.com |
|
| 23-Copper/Low-K |
Jie |
Xue |
|
Cisco |
jixue@cisco.com |
847-947-0938 |
| 23-Copper/Low-K |
Ron |
Zhang |
|
Sun Microsystems |
ron.zhang@sun.com |
408-616-5847 |
| 24-Microwave/High Frequency |
Ron |
Barnett |
|
National Instruments |
rbarnett@ni.com |
707-577-1929 |
| 24-Microwave/High Frequency |
Aicha |
Elshabini |
Co-Chair |
University of Idaho |
elshabini@uidaho.edu |
208-885-6479 |
| 24-Microwave/High Frequency |
John |
Gipprich |
|
Cable Speed |
ljgipprich@cablespeed.com |
410-987-5643 |
| 24-Microwave/High Frequency |
Ken |
Kuang |
|
Torrey Hills Technologies, LLC |
kkuang@torreyhillstech.com |
858-722-4805 |
| 24-Microwave/High Frequency |
Steven |
Lehnert |
|
Space Systems Loral |
lehnerts@ssd.loral.com |
650-852-5881 |
| 24-Microwave/High Frequency |
Scott |
Morris |
|
Skyworks Solutions |
scott.morris@skyworksinc.com |
336-291-4227 |
| 24-Microwave/High Frequency |
Jens |
Mueller |
|
Technical Univ. of Ilmenau |
jens.mueller@imaps.de |
+49 9281 478431 |
| 24-Microwave/High Frequency |
Glenn |
Oliver |
|
DuPont Electronic Technologies |
glenn.e.oliver@usa.dupont.com |
919-248-5425 |
| 24-Microwave/High Frequency |
Art |
Prejs |
|
CREE |
Art_Prejs@cree.com |
|
| 24-Microwave/High Frequency |
Tracey |
Vincent |
|
Barry Industries |
tracey.s.vincent@gmail.com |
508-226-3350 |
| 25-3D Packaging |
Charles |
Banda |
|
Laboratory for Physical Sciences |
charles.banda@jhuapl.edu |
|
| 25-3D Packaging |
Christo |
Bojkov |
|
Freescale Semiconductor |
christo.bojkov@freescale.com |
512-895-3870 |
| 25-3D Packaging |
Ray |
Fillion |
|
Fillion Consulting |
fillion.consulting@gmail.com |
518-810-1519 |
| 25-3D Packaging |
Paul |
Franzon |
|
NC State University |
paulf@ncsu.edu |
|
| 25-3D Packaging |
Phil |
Garrou |
|
Microelectronic Consultants of NC |
philgarrou@att.net |
|
| 25-3D Packaging |
James |
Lu |
Chair |
Rensselaer Polytechnic Institute |
luj@rpi.edu |
518-276-2909 |
| 25-3D Packaging |
Georg |
Meyer-Berg |
|
Infineon |
georg.meyer-berg@infineon.com |
|
| 25-3D Packaging |
Kevin |
Moores |
|
DoD |
kevin.a.moores@ugov.gov |
|
| 25-3D Packaging |
Urmi |
Ray |
|
Qualcomm, Inc. |
uray@qualcomm.com |
|
| 25-3D Packaging |
Milind |
Shah |
|
Qualcomm |
milinds@qualcomm.com |
|
| 25-3D Packaging |
Vern |
Solberg |
|
Tessera |
vsolberg123@aol.com |
408-568-3734 |
| 25-3D Packaging |
Peng |
Su |
|
Cisco Systems |
pensu@cisco.com |
408-853-6061 |
| 25-3D Packaging |
Venky |
Sundaram |
|
Georgia Tech. University |
vs24@mail.gatech.edu |
|
| 26-Biomedical |
Steven |
Adamson |
|
Nordson Asymtek |
Steven.Adamson@nordsonasymtek.com |
760-930-7274 |
| 26-Biomedical |
Sharad |
Bhatt |
|
Shanta Systems Inc. |
sharad_bhatt@compuserve.com |
814-362-6996 |
| 26-Biomedical |
Joan |
Delalic |
Chair |
Temple University |
joan@temple.edu |
215-204-3382 |
| 26-Biomedical |
Brian |
Farrell |
|
Foster Miller, Inc. |
bfarrell@foster-miller.com |
781-684-4150 |
| 26-Biomedical |
Matt |
Gordon |
|
University of Arkansas |
mhg@engr.uark.edu |
479-575-4458 |
| 26-Biomedical |
Son |
Nguyen |
|
Temple University |
stnguyen@temple.edu |
484-753-1320 |
| 26-Biomedical |
Kedar |
Shah |
|
Lawrence Livermore National Lab. |
shah22@llnl.gov |
925-422-7296 |
| 27-Signal and Power Integrity |
Dale |
Becker |
|
IBM |
wbecker@us.ibm.com |
|
| 27-Signal and Power Integrity |
Sanjeev |
Gupta |
|
Agilent Technologies |
sanjeev_gupta@agilent.com |
|
| 27-Signal and Power Integrity |
Ivan |
Ndip |
Chair |
Fraunhofer Institute for Reliability and Microintegration (FhG-IZM) |
ivan.ndip@izm.fraunhofer.de |
49-304-640-3679 |
| 27-Signal and Power Integrity |
Judy |
Priest |
Co-Chair |
Cisco |
judyp@cisco.com |
|
| 27-Signal and Power Integrity |
Edward |
Sayre |
|
Northeast Systems Associates |
esayre@nesa.com |
|
| Chinese Translated |
Bill |
Chen |
|
Tsinghua University |
chenbill@gmail.com |
|
| Chinese Translated |
Yi-Shao |
Lai |
|
ASE |
yishao_lai@aseglobal.com |
886-7-3617131 (15285) |
| Poster Session |
Sara |
Paisner |
|
PN&S Consulting, LLC |
spaisner@gmail.com |
|
| Poster Session |
Urmi |
Ray |
|
Qualcomm, Inc. |
uray@qualcomm.com |
|
