Journal of
Microelectronics
and Electronic Packaging
(ISSN # 1551-4897)
Foreword . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . Fred D. Barlow III, Editor-in-Chief |
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INVITED PAPER: |
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REGULAR CONTRIBUTIONS: |
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| Maximum Attainable Deflections of Shape Memory Alloy-Layered Microcantilever . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P. Majumder and A. Bhattacharyya, University of Arkansas |
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| Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSP) . . . . . . . . . . . . . M.K. Abdullah, M.Z. Abdullah, M.A. Mujeebu, S. Kamaruddin and Z.M. Ariff, Universiti Sains Malayasia |
62 |
| Numerical Optimization of Silicon Stacked Module for 3-D Packaging Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A.G.K. Viswanath, X. Zhang, Y.Y. Wang, S.W. Yoon, N. Khan and V. Kripesh, A*STAR |
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| Laser Sintering of Silver Nanomaterial on Polymer Substrates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A. Khan, N. Rasmussen, V. Marinov and O.F. Swenson, North Dakota State University |
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| Heatsink Mass Optimization Methodology for Desktop Microprocessor Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A.A. Merrikh, M. Eyman, D.B. Walshak, T. Dolbear and S. Sundaram, Advanced Micro Devices |
87 |
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