Editorial
F. Barlow
Invited Papers (IMAPS 2006*, CICMT 2007):
*Improvement of High-Temperature Reliability of Ball Bond
Using Platinum-Modified Gold Alloy Wires
K. Maki, Y. Nakata, M. Nagao, A. Mishima
LTCC Enzymatic Microreactor
K. Malecha, D. Pijanowska, L. Golonka, W. Torbicz
Suppression of SSN by Embedded Decoupling Capacitor
in LTCC Package
Y. Park, K. Oh, I. Kim, H. Chu, J. Sung, S. Yun, J. Kim
Regular Contributions:
Single Sample Cylinder for RGA Correlation
P. Schuessler, D. Rossiter, R. Lowry, S. Sierzant
Investigation of the Lead-free Solder Joint Shear Performance
J. Webster, J. Pan, B. Toleno
Development of High Reliability Via on IVH (VONI) for
High Density Interconnect Circuit Boards
J. Park, Y. Hwang, I. Jeun, D. Joung, M. Chong, D. Yang
