Regular Contributions:

A Novel Scheme for Wide Bandwidth Chip-to-Chip Communications
Q. Liu, P. Fay, G. Bernstein

Effect of Silane Functional Group on Adhesion of Selected Epoxies for Microelectronic Packaging
M. Jenkins Borrego, R. Dauskardt, J. Bravman

Micromachined LCP Connectors for Packaging MEMS Devices in Biological Environments
R. Dean, J. Weller, M. Bozack, B. Farrell, L. Jauniskis, J. Ting, D. Edell, J. Hetke

Transient Thermal Characterization of Stacked Multichip Package
K. Kaija, P. Heino

Miniature Multi-electrode Electrochemical Cell in LTCC
J. Youngsman, B. Marx, S. Wolter, J. Glass, A. Moll

Fatigue Assessment of Solder Bumps on Board Assemblies Affected by PWB Warpage
W. Tan, I.C. Ume