Editorial
Mr.
Delip "Doug" Bokil
Welcome
to the first quarterly issue of year 2006. This
issue consists of two sections; the first one contains
two
papers from IMAPS-2005 that were awarded "Best
Paper" classification, and the second section contains
four papers from the IMAPS-Bruges-2005, Belgium, symposium.
As is our policy all papers were reviewed by members
of our Advisory Board.
Invited
Manuscripts (Best Papers - IMAPS 2005):
Novel
Method of Separating Probe and Wire Bond Regions without
Increasing
Die Size and Reducing Weak Fab-Back End of Line Adhesion
Interfaces
C. Lee, T. Tran, B. Williams, J. Ross
Effect
of Compatibility between Fluxes and Cyanate Ester Underfill
on Lead Free Flip Chip Assembly and Reliability
R. Chaware, L. Stiborek, J. Libres, M. Marquez, C. Odegard,M.
Cowens, M. Venkateswaran
Invited
Manuscripts (Bruges-2005, Belgium):
Ball
Bonding Process Robustification with regard to Space
Applications
Libon S.P., Paelinck P., Goffin B.
Electro-migration
behavior of Pb-free Flip Chip Bumps
R. Labie, T. Webers, B. Swinnen, E. Beyne
Properties
and Stability of Thick-Film Resistors with Low Processing
Temperatures -
Effect of Composition and Processing Parameters
S. Menot-Vionnet, T. Maeder, C. Grimaldi, C. Jacq, P.
Ryser
Electrical
Characterization of High Performance Memory FBGA
BOC Package
Gospodinova M., Nan G., Thomas J., Subraya R., Held J.
