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Journal of Microelectronics
and Electronic Packaging

Volume 1, Number 1
First Quarter 2004
download pdf of full Journal

As a result of the name change of the IMAPS Journal, we have had to reapply for a new ISSN. This process should be completed soon with the new ISSN available before release of the 3rd Quarter Issue.

Board Via Effect On Thermal Performance Of A Leadless Package
Heinz Pape, Kay Schiller and Rudolf Kutscherauer

Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements
Peter Rodgers

Extraction of a Dynamic Multiport Compact Thermal Model for a Silicon Microthruster
M. Salleras, J. Palacin, I. García, M. Puig, J. Samitier, S. Marco

An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic Packages
K. Friedel; A. Wymyslowski

 

 
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