The San Diego Chapter of IMAPS represents members from the greater San Diego area in California. As one of the most active chapters of IMAPS, meetings or events are typically held monthly as part of a lunch speaker series, with exception for summer break.
The San Diego Chapter always welcomes interested speakers and company hosts for upcoming meetings. Contact Chapter President Iris Labadie (Iris.Labadie@kyocera.com) to express interest in:
- Speaking at a chapter event
- Hosting a chapter event at your facility
- Sponsoring a chapter meeting or webinar
- Joining IMAPS
Upcoming 2017 Chapter Events
Save the date! Each event will be activated with a registration link when more details become available. Click here to view all upcoming IMAPS events.
August 29 Technical Presentation and Lunch
Topic:CPI & CBI Risks to FOWLP
Location:Kyocera, 8611 Balboa Avenue, San Diego, CA 92123
RSVP Required: Click here to register
With the advent of thinner die/packages, new materials and more complex packages Chip Package Interaction(CPI) has become a larger concern for the industry. As the name implies CPI has traditionally been viewed as a component level concern. Wafer Level Packages and variants such as Fan Out Wafer Level Packages (FOWLP) now bring an additional risk which we refer to as Chip Board Interaction. This talk will discuss some of the basics of the CPI and CBI risks to FOWLP which include both mechanical and electrical risks to products. These mechanisms span the Design, Process and Package domains and as such requires collaborative efforts to manage the risks and trade-offs.
Mark Nakamoto currently is a member of Qualcomm’s Package Engineering Organization. He leads the eCPI Team working on the development of Modeling, Characterization and Analysis of the electrical impacts of Chip Package Interaction. Mark has over 30 years of experience in the Semiconductor Industry spanning Silicon Process Development, Process and Device Characterization, Test Structure Design, Reliability, Modeling, Design for Manufacturability, 2.5D and 3D Development and Chip Package Interaction. Prior to Qualcomm Mark held various positions in PDF Solutions, Cadence Design Systems, and Unisys/Burroughs.
Past Chapter Events
April 25 Presentation and Lunch
James Webb Space Telescope: Parts, Materials and Processes
Presented by Dr. Michael Vernoy
Topic: James Webb Space Telescope: Parts, Materials, and Processes
Presenter: Dr. Michael Vernoy - Northrup Grumman Aerospace Systems
James Webb Space Telescope (JWST). JWST is a fascinating tennis court-sized infrared space telescope which will be NASA's premiere space observatory for the next decade. After launch, it will begin to unlock many secrets, including details of the universe's first stars, and of the formation of ours and other solar systems- including ones that could be supporting life.
Dr. Vernoy highlighted the challenges of material selection for the segmented mirrors and the sunshields to survive the space environment. While the Hubble telescope has a 2.4 meter mirror, the JWST features a larger segmented mirror- 6.5 meter diameter and will be located near Earth-Sun L2 point. The primary mirror segments are made of Beryllium and then coated with gold. A large sunshield will keep its mirror and four science instruments below 5K ( -220C ; - 370F). The sunshield will block heat and light from the Sun and Earth. The 3 major sections of the JWST include an optical telescope element, mirror and its structure, the Spacecraft Element which includes spacecraft bus + sunshield and the Integrated science instrument module which holds instruments and other systems. The Spacecraft Bus must support the 6.5 ton space telescope , while it itself weighs 350 Kg. It is made primarily of graphite material. The instruments module will have near IR camera, Near Infrared Spectrograph , Mid IR Instrument and Near IR imager + Slitless Spectrograph. The presentation was a good overview and insight into the challenges of design and architecture of the JWST telescope.
Vice Chair and Programs
IMAPS Advisor Chair
ACerS Advisor Chair
Meet the board!
EMD Performance Materials
Quik-Pak, a division of Promex Industries
Accu-Tech Laser Processing, Inc.
AGC Electronics America
Torrey Hills Technologies
Advanced Packaging Associates
University of California San Diego