Honeywell

IMAPS Northern California Chapter

 

The Northern California Chapter of IMAPS represents members from the greater Bay Area of California, including San Francisco and San Jose.

Upcoming 2018 Chapter Events
Save the date! Each event will be activated with a registration link when more details become available. Click here to view all upcoming IMAPS events.

Semiconductor Speaker Series Luncheon | September 12

Wednesday, September 12, 2018 / 11:30am - 1:00 pm
(Registration opens and lunch starts at 11:30am / Talk starts at noon)
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035

Register Here

Package Assembly Design Kits - The Technology Bridge between Chip Design and High-Density Fan Out Design, Manufacturing, and Assembly
Ruben Fuentes, Vice President, WW Design


Process design kits (PDKs) are well-known catalysts in integrated circuit (IC) design. However, they are somewhat of a mystery and a new concept to the packaging world. As a result, many packaging engineers do not understand why PDKs are pivotal to the success of IC designs. Traditionally, packaging companies provide only a copy of their design rules because package design rules tend to be very dynamic. This concept is where IC design and traditional package design philosophies collide. In high-density fan-out (HDFO) applications, the practice of sharing only design rules creates many unnecessary delays and back-and-forth design iterations between the package designer and the HDFO manufacturer. In contrast, package assembly design kits (PADKs) enable designers to validate their designs throughout the design process. Although package design and IC design are two different worlds, they do share several key similarities. These similarities have contributed to the successful use of package assembly design kits. Attendees can expect to leave with a broader understanding of how PADKs can significantly increase productivity, reduce cycle times and limit the number of design iterations in HDFO applications.


Semiconductor Speaker Series Luncheon | October 22

Monday, October 22, 2018 / 11:30am - 1:00 pm
(Registration opens and lunch starts at 11:30am / Talk starts at noon)
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035

Register Here
 

The Road Ahead:  Outlook for the Industry 
E. Jan Vardaman, President, TechSearch International, Inc.

The semiconductor industry has seen record growth in the last few years, but with slowing growth in the smartphone shipments and PC sales what’s next?  What will drive growth in advanced packaging? Is it Game Over for Cryptocurrency? Artificial Intelligence and automotive electronic are bright spots, but what type of packages will be used?  How will OSATs benefit and what role will the foundry play? This presentation will examine economic and technology trends and provides an outlook for the industry. 

Registration closes Friday, October 19 at 5pm PST  

Past Chapter Events

The Semiconductor Industry Speaker Series

Wednesday, June 13, 2018 / 11:30am - 1:00 pm
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035

Industry Outlook and Technology Trends in IC Packaging Market
Andrea Lati, Director of Market Research
VLSI Research

 

Electronic Assembly/Reliability Research Symposium
Tuesday, May 1, 2018 / 9:00 am to 5:00 pm
hosted at
NEXTFLEX
2244 Blach Place, Suite 150, San Jose, CA 95131

The Semiconductor Industry Speaker Series Luncheon

 Wednesday, May 9, 2018 / 11:30am - 1:30 pm 
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035

 

The Semiconductor Industry Speaker Series Luncheon
Wednesday, April 18, 2018 / 11:30am - 1:30 pm
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035
 
Emerging ADAS Thermal Performance and Reliability:  Needs and Solutions
Karthik Srinivasan, Senior Corporate AE Manager, Analog & Mixed Signal Products, Semiconductor Business Unit, Ansys Inc.

The Semiconductor Industry Speaker Series
Wednesday, March 14, 2018 / 11:30am - 1:30 pm
SEMI Global Headquarters
673 South Milpitas Blvd., Milpitas, CA 95035

Packaging Innovation for our Application Driven World
Rich Rice, Senior VP, Business Development, ASE US, Inc.

The semiconductor market performed very well in 2017, underscoring broader electronic market dynamics and overall improved economic buoyancy. As we venture further into 2018, positive economic indicators point to continued growth. So, what is there to worry about? On the other side of the coin, our two largest drivers for semiconductor revenues have essentially flattened out over recent times, so it is imperative that we collectively identify and nurture new applications that can stimulate and maintain further growth. During his talk, Rich Rice will discuss where some of these new opportunities might lie, while describing the importance of IC packaging innovation to enable and support many such new applications. Rice will also give consideration to how key elements of supply chain collaboration are essential in driving new solutions.

 

The Semiconductor Industry Speaker Series
Monday, November 13, 2017 / 11:30 am – 1:30 pm
SEMI Global Headquarters, Milpitas, California

IMAPS | MEPTEC
NextFlex Presentation and Facility Tour
Wednesday, June 7 at NextFlex Headquarters
12:30pm-1:30pm

Get Involved
The Northwest Chapter always welcomes interested speakers and company hosts for upcoming meetings. Contact IMAPS Membership Administrator Shelby Moirano (smoirano@imaps.org) to express interest in:

  • Leadership opportunities
  • Speaking at a chapter event
  • Hosting a chapter event at your facility
  • Sponsoring a chapter meeting or webinar
  • Joining IMAPS

 

Chapter Officers

David Towne
Chapter President

Corporate Members

ASE US, Inc.
Canon USA
NTK Technologies, Inc.
Promex Industries, Inc.
Camtek USA
Deweyl Tool Company
DOWA International Corporation
Hesse Mechatronics, Inc.
JSR Micro, Inc.
NAMICS Corporation
Nikon Precision, Inc.
Nordson DAGE
Royce Instruments
Shenmao America Inc.
Shinko Electronic America
Silicon Valley Materials Technology
STATS ChipPAC, Inc.
Taiyo Ink. Mfg. Co., Ltd.
Tanaka Precious Metals
Zeta Instruments
Pac Tech Packaging Technologies

 

 

 

 

 


 
CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems