2nd Advanced Technology Workshop on
Automotive Microelectronics and Packaging

Doubletree Hotel
Dearborn, Michigan - USA
May 11-14, 2009

ABSTRACT DEADLINE: December 12, 2008
HOTEL DEADLINE: April 1, 2009

Workshop Overview

Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need.

Planned Sessions Include:

Systems & Applications

• Power/Hybrid Modules
• Powertrain Control
• Collision Avoidance and Safety
• X-by-Wire
• Driver Comfort/Information/Audio Systems
• Telematics

Design

• Thermal and Power Management
• RF/Wireless/mmWave/RADAR/LIDAR/IR
• Harsh Environment
• MEMS and Sensors
• High Performance Interconnects
• Systems on Chip

Materials & Process

• Thermal and Power Packaging
• Sensor and MEMS Packaging
• Advanced Interconnects, Connectors and Wirebonding
• Ceramic Substrates and Ceramic Technologies
• High Density and High Performance Organic Substrates
• Underfill/Encapsulants and Adhesives
• Solder Materials, Processes, and Reliability
• Flip-Chip and Bumping: Processes, Reliability
• LED Packaging
• Embedded and Integrated Passives
• Green Packaging/Compliance with RoHS

Those wishing to make a presentation at the Automotive Workshop, please submit a 250-300 word abstract electronically by December 12, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

All abstracts submitted must represent advanced technology and can be unpublished work. The abstracts should highlight the application area, design, and process or material covered within the automotive industry.

No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on April 10, 2009. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Submit Abstract(s)

Speaker Dates/Information:

• Abstract Deadline: December 12, 2008
• Hotel and Early Registration Deadlines: April 1, 2009
• Extended Abstract or Abstract Book Materials due: April 10, 2009
• Powerpoint/Presentation file for CD-Rom due not later than: May 14 , 2009
• Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
• Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

Hotel Reservations (Hotel Deadline: April 1, 2009)
Reservation must be made directly with the:

DoubleTree Hotel Dearborn
5801 Southfield Expressway
Detroit, MI 48228

Phone: (313) 336-3340 or toll free (800) 222-TREE
On-line: http://doubletree.hilton.com/en/dt/groups/personalized/DTTDBDT-ATW-20090504/index.jhtml (group code ATW)

$128 per night (plus tax) single/double