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IMAPS 2010 - Research Triangle
43rd International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!
The 43rd International Symposium on Microelectronics will be held at the Raleigh Convention Center, Research Triangle, North Carolina, USA, and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2010 will feature technical tracks on 3D Packaging/Interconnect, Design, Reliability, Advanced Packaging and Material. 25 technical sessions will be featured this year including sessions on: 3D IC at RTP, 3D Packaging, 3D Systems Integration, 3D TSV Processes, Materials, Ceramics/LTCC, Flip Chip, WL/CSP, LED, MEMS, Modeling & Design, Pb-Free Solder, Printed/3D Structural Electronics, Thermal, Wire Bonding and more. This year's symposium will also offer you 18 professional development courses, a GBC Marketing Forum on Photovoltaics and 3D, and keynote presentations from Dr. John Edmond, co-founder CREE Research, and Dr. Rao Tummala, Georgia Tech.
The IMAPS 2010 website is still in production but you may pull up much of the symposium programs now. The official design and full details will be added in early August.
IMAPS 2010 features...
| Complimentary Exhibit Hall Passes |
Exhibits Passes are complimentary this year for all attendees. This complimentary registration will allow participants to visit the exhibitors, the welcome reception, the keynote presentations, the GBC Marketing Forum. (PDCs, Sessions, Proceedings and Lunch are not included) |
Two World-Renown Keynote Presentations
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Dr. John Edmond
Co-Founder
CREE Research, Inc.
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Dr. Rao Tummala
Professor and Director of 3D Systems Packaging Research Center
Georgia Institute of Technology |
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| 18
Professional Development Courses |
Intro
to Microelectronics Packaging...; TSV...3D IC/Si Integrations; Thermal Management...; Wire Bonding...; 3D Integration and Packaging...; 3D IC Integration...; Signal/Power Integrity; MEMS Reliability...; LED Packaging...; and many
more. |
An Unmatched, Global Technical Program
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25 Sessions, 190+ Papers and Posters
5
Concurrent Technical Tracks addressing:
NEW 3D Packaging/Integration Track with 5 sessions/panel
Other Tracks on: Modeling/Reliability; Next Gen. Materials; Assembly & Packaging; Advanced Technologies
Program at a Glance | Interactive
Track | Download Program PDF |
| State-of-the-Art
Exhibition and Technology Showcase |
Dedicated exhibit hall displaying new products and concepts. |
| Global
Business Council Marketing Forum |
Materials for Photovoltaics and 3D Packaging |
| Invaluable Student Program |
Student Industry Panel/Reception, DuPont Plant Tour, Student Competitions and other programs are designed to provide students with technical information, industry insight, and valuable connections. |
...and that's only the technical side of the Symposium! There are also a lot of other exciting activites planned for you -- the 16th Annual Golf Classic, the Welcome Reception, to name only a few.
We hope you enjoy the 43rd International Symposium on Microelectronics - IMAPS 2010, Research Triangle!
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