IMAPS - Wafer Level Chip Scale Packaging Workshop of Device Packaging 2009 Conference

5th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 10-12, 2009

Exhibition and Technology Showcase
March 10-11, 2009

Professional Development Courses
March 9, 2009

GBC Spring Conference
March 8-9, 2009

In conjunction with the Global Business Council (GBC) Spring Conference, March 8-9

Courtesy of FlipChip International, LLC

Courtesy of Rensselaer Polytechnic Institute

General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer

Announcement and Call for Abstracts
Topical Workshop on
Wafer Level Chip Scale Packaging
Download PDF
This workshop is being held as a part of the Device Packaging Conference

Abstract Deadline: December 5, 2008

Technical Chair: Beth Keser Freescale Semiconductor Tempe, AZ 85284 Phone: 480-413-8022 Beth.Keser@freescale.com	Technical Chair: Andrew Strandjord PacTech Santa Clara, CA 95050 Phone: 719-244-4277 strandjord@pactech-usa.com

Wafer Level Chip Scale Packaging Organizing Committee: Kyle Baker, CMD Lars Boettcher, Fraunhofer IZM Christo Bojkov, Freescale Semiconductor, Inc. Ravi Chilukuri, Amkor Technology Chunho Kim, Intel Corporation Vince Kinol, Umicore Luu Nguyen, National Semiconductor Corp. Umesh Sharma, CMD

Wafer Level Chip Scale Packaging Workshop Focus:
The objective of the Wafer Level Chip Scale Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wafer Level Chip Scale Packaging (WLCSP). This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to these new packaging technologies

Attendees and presenters in the past have found that the Wafer Level Chip Scale Packaging Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry. If you are working in any area of electronics packaging or microelectronics, the Workshop on Wafer Level Chip Scale Packaging technologies would be well worth attending. Abstracts are being requested on the following topics:

Chip Scale Packaging (CSP and WLCSP)
Wafer Bumping Materials (UBM, Solder, RDL and Repassivation)
Manufacturing Processes
Assembly Processes
Reliability
Mechanical Testing: (Drop Test, High Speed Pull, Vibration, Shear…)
Modeling (Thermal and Mechanical)
End use applications (i.e., OEM products)

Those wishing to present in the Wafer Level Chip Scale Packaging sector of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 5, 2008, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than December 5, 2008.

Interested in Exhibits? Contact Ann Bell - abell@imaps.org
Interested in helping organize the 2009 Conference? Contact Brian Schieman - bschieman@imaps.org

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.

HOUSING
Hotel Reservation Deadline - February 6, 2009

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

On-line Reservations - Promotional Code: IMAPS9

Speaker Dates/Information:

Abstracts due: December 5, 2008
Extended Abstract or Abstract Book Materials due: January 30, 2009
Hotel Reservation Deadline: February 6, 2009
Powerpoint/Presentation file for CD-Rom due not later than: March 12, 2009 (Last day of Conference)
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)