IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us

7th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 8-10, 2011
Exhibition and Technology Showcase
March 8-9, 2011
Professional Development Courses
March 7, 2011
GBC Spring Conference
March 6-7, 2011

In conjunction with the Global Business Council (GBC) Spring Conference, March 6-7


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Phil Garrou
Microelectronic Consultants of NC


3D Packaging
Topical Workshop
Flip Chip Technologies
Topical Workshop
Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Emerging Tech (LEDs & Passives)
Topical Workshop
Technical Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
Technical Co-Chair:
Linda Bal
Freescale Semiconductor
Technical Co-Chair:
Ted Tessier
FlipChip International
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Frank Wall
Philips
Technical Co-Chair:
Lee Smith
Amkor Technology
Technical Co-Chair:
Lou Nicholls
Amkor Technology
Technical Co-Chair:
Andrew Strandjord
Pac Tech USA
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Robert Heistand
AVX

EARLY REGISTRATION CUT-OFF: FEBRUARY 3, 2011
HOTEL DEADLINE: FEBRUARY 2, 2011


Submit Abstract(s) | Hotel Reservations
Speaker Information
|
Exhibition |
Reserve Exhibits On-line |
Floorplan | 2010 Exhibitors | 2009 Exhibitors
Global Business Council (GBC) Spring Conference


Conference Overview:

Full Conference Details and Call for Abstracts Available in July 2010

The seventh Annual Device Packaging Conference (DPC2011) will be held in Scottsdale, Arizona, on March 7-10, 2011. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.





Housing
Hotel Reservation Deadline - February 3, 2011

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$149 single/double

Phone Reservations: (480) 789-5300

Online Reservations:
http://www.radisson.com/reservation/resEntrance.do?pacLink=Y&promoCode=IMAP11&hotelCode=AZMCDOWE

Or use Promotional Code: IMAP11 from the hotel’s direct website: http://www.radisson.com/hotels/azmcdowe

**Working on special reservation process for government rate.



Speaker Dates/Information:

  • Abstracts Deadline: November/December, 2010
  • Hotel Reservation Deadline: February 3, 2011
  • Extended Abstract or Abstract Book Materials due: February 2011
  • Early Registration Deadline: February 3, 2011
  • Powerpoint/Presentation file for CD-Rom due not later than: March 10, 2011 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)




Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>