5th International Conference and Exhibition on Device Packaging www.imaps.org/devicepackaging Radisson Fort McDowell Resort and Casino Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops March 10-12, 2009 Exhibition and Technology Showcase March 10-11, 2009 Professional Development Courses March 9, 2009 GBC Spring Conference March 8-9, 2009 In conjunction with the Global Business Council (GBC) Spring Conference, March 8-9 Courtesy of FlipChip International, LLC Courtesy of Rensselaer Polytechnic Institute General Chair: Ted Tessier FlipChip International Chief Technical Officer

Exhibiting Companies

Exhibit Brochure | Floorplan | 2008 Exhibitors

Device Packaging Exhibit and Technology Show:
Device Packaging 2009 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006, 2007 and 2008 exhibitions were sold out early. The 2009 Conference exhibit hall has also sold out in late-December 2008. You can contact Ann (below) to put your name on the waiting list..

Questions? Contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Here are the companies that have already reserved exhibit space: