2018 INTERNATIONAL CONFERENCE & EXHIBITION ON DEVICE PACKAGING
Technical Program Announced - Register Now!
New PDC Format
Sold Out Exhibition!
TECHNICAL TRACKS : -Modules-SiP/SiM;
-Wafer Level/Panel (RDL);
- Flip Chip/2.5d/3d;
-Process, Materials, CPI...
The gateway to exclusive microelectronics-focused research and content.
NOW AVAILABLE: Proceedings of the 50th Symposium on Microelectronics.
* Easy online access * Wider visibility & searchability * Citability * GoogleScholar access...
Student Opportunities & Grants/Awards!
Opening doors for students of all levels with grants, awards, and industry exposure opportunities
Device Packaging 2018
CICMT 2018 (Portugal)
HiTEC 2018 - High Temperature Electronics
IMAPS 2018 - Pasadena
Device Packaging 2019
IMAPS 2019 - Boston
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About, Recipients, Nominations...
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