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IMAPS leads the Microelectronics Packaging, Interconnect and Assembly Community,
providing means of communicating, educating and interacting at all levels.

The International Microelectronics Assembly and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain. Our events and products focus on those technologies critical to the present and future of microelectronics: 3D Integration, MEMS, Flip Chip, Wafer Level Packaging,Thermal Management, Printed Electronics, Advanced Materials, Photonics, Modeling/Design and many others. (Read more about IMAPS)

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IMAPS 2014 - San Diego
Webinars (On-line Meetings)
Calendar of Events
Nano Devices 2014
April 29-30, 2014
HiTEC 2014 (High Temp.)
May 13-15, 2014
IMAPS 2014 (San Diego)
October 13-16, 2014
Thermal Management
October 28-30, 2014
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Technical Program Archives

Featured CD-Roms & USB Drives:
IMAPS 2013 Orlando USB
HiTEN 2013 CD
Medical/Hi-Rel 2013 CD
Nano 2013 Workshop

Device Packaging 2013 USB
Wire Bonding 2013 CD

Thermal Management 2012 CD
IMAPS 2012 San Diego USB
Device Packaging 2012 USB

Featured Webinar Replay:
Jessica Sylvester

iKNOW Microelectronics
IMAPS On-line Library

Find Papers in iKNOW

Advancing Microelectronics Magazine Advancing Microelectronics
2014 - Issue 1
DPC, Wafer Level Packaging, IPD
Journal of Microelectronics and Electronic Packaging (JMEP)

Journal of Microelectronics and Electronic Packaging
2014 - 1st Quarter

Subscribe to JMEP 2014

Q1 2014 JMEP Featured Papers:

Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding

LT-TLPS Die Attach for High Temperature Electronic Packaging

Redistribution Layers (RDLs) for 2.5D/3D IC Integration

Reliability of SiC Digital Telemetry Circuits on AlN Substrate

Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures

Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates

Ultra Low Weight Spacer for PCB to PCB Interconnections

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Addressing the Business Side of Microelectronics!

GBC Corporate Spotlight
GBC Corporate Spotlight: ALLVIA

Member Spotlight

Lee Smith, Plexus Corporation
Lee Smith

RGL Enterprises


Palomar Technologies





Torrey Hills Technologies

Oneida Research Services



Master Bond

RGL Enterprises

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