Events


Wire Bonding
February 9-10, 2016

Device Packaging
March 15-17, 2016

RaMP (RF/Microwave)
April 5-6, 2016

Chip Pkg. Interactions w/ FO-WLP
April 6-7, 2016

CICMT - Ceramic Interconnect
April 19-21, 2016

Symposium on Polymers
April 25-27, 2016

HiTEC - High Temperature
May 10-12, 2016

Additive Manufacturing
NEW date: June 28-29, 2016

Advances in Semiconductor Packaging (ASP)
September 22, 2016

Thermal Management
October 25-27, 2016

IMAPS 2016 - Pasadena
October 10-13, 2016


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