IMAPS leads the Microelectronics Packaging,
Interconnect and Assembly Community,
providing means of
communicating, educating and interacting at all levels.
The International Microelectronics Assembly and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain. Our events and products focus on those technologies critical to the present and future of microelectronics: 3D Integration, MEMS, Flip Chip, Wafer Level Packaging,Thermal Management, Printed Electronics, Advanced Materials, Photonics, Modeling/Design and many others. (Read more about IMAPS)
